Thorough attention was paid to the effect of the hatch distance on the cutting quality and characteristic strength of glass strips cut in both environments. Low (2.1–2.75 W) and high (15.5 W) average laser power cutting regimes were studied.
In this study, the cutting of borosilicate glass plates in ambient air and water with a 355 nm wavelength picosecond laser was carried out. However, the author 20 did not mention the mechanical frac- turing system that was used to separate the samples along the scribe. However, the power densities must be selected carefully to effectively evaporate without causing large amount of melting. It was found that a pulsed laser gives better results than CO 2 laser in scribing operation because it generates higher peak powers which evaporates more material and gives less time for the absorbed energy to be conducted. CO 2 laser with a wavelength of 10.6 lm was found to be ideal for scribing most nonmetals. 27 Lumley 20 demonstrated the use of CO 2 and Nd:YAG lasers for laser scribing. Several patents for laser scribing are available such as Patel and Baker 26 and Wills et al. Therefore, finishing processes are required, which add extra cost to the manufacturer. 25 The scribing process incurs damage to the cut edge which can also cause damage to the glass surface.
#GROOVE SCRIBE ALTERNATIVEW CRACK#
In the second stage, breaking by applying a mechanical force takes place normally with the help of vacuum chucks or by crack rollers. It is necessary to con- centrate the laser energy on a narrow line with the workpiece in the focal plane. In the first stage, partially penetrating holes, a groove or deep vents at depths of one third to one half of the material thickness, are produced using a laser. The process is shown schematically in Fig.
19 Laser scribing is a two stage process and is quite similar to traditional mechanical scribe and break method. scribing for brittle materials was originally pro- posed by Garibotti.
0 kommentar(er)
